Averatek, the technology innovator for next-generation electronic capabilities is all set to collaborate with Toyo Aluminium K.K. (Toyo), the developer of eco-friendly aluminium products to manufacture a new catalysed aluminium foil named, Ranafoil destined for A-SAP.
The technical void between mSAP HDI PCB and the packaging substrates can be journeyed by Averatek Semi-Additive Process (A-SAP) and the materials mentioned above. This innovation enlarges the scope of material selection for package substrate manufacturing.
The Averatek Semi-Additive Process or A-SAP™ can be applied to an infinite range of materials with a thin electro-less base copper layer, differentiating it from the conventional semi-additive processes (SAPs). Liquid Metal Ink or LMI™ constitutes the palladium catalyst that, in turn, allows lower than 10 nanometres of smooth metal coating with A-SAP™.
Catalysed aluminium foil from Toyo is used by the processes of Aluminium Clad Laminate (ACL) and Catalyzed Build-up Film (CBF) to get a well-administered surface texture for the technology and some invariably coated palladium metal. Though technically developed for the exterior and the build-up layers, ACL and CBF also promote the use of A-SAP.
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